高性能氧化鋯承燒板,是電子產(chǎn)品燒制過程中的承燒窯具,適用于磁性材料、陶瓷電容、PTC、電感、壓電陶瓷等行業(yè)。
所用材料采用高純氧化鋯制成,與其它材料制成的承燒板相比,具有與所承燒的電子產(chǎn)品不發(fā)生化學(xué)反應(yīng)和粘連的優(yōu)點(diǎn),能保障電子產(chǎn)品性能的穩(wěn)定性和一致性,提高燒成合格率;機(jī)械性能優(yōu)良,能承載大量電子產(chǎn)品;熱震穩(wěn)定性好,使用壽命長。
High Capability Zirconia Board: It is burning pudding in the electron products, widely used in magnetism material, porcelain capacitor, PTC, piezoceramics industry
The material is made of high purity zirconia, it will not rise chemistry reaction or conglutination in the burning electron products compared with other burning beaker of different material. It guarantee the stability &consistency of the electron products. It also improve the burning eligibility, machine performance is choiceness. It can load a wide large of electron products; hot vibrate stability is well, bestow lift-span is long.
一、常用規(guī)格 (mm)
敷 板
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敷 板
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敷 板
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異 型 條
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112*112
300*150 98*98 93*83 |
113*113
170*170 145*145 140*140 |
130*130
150*150 115*115 ¢117 83*83 |
V60*18
G72*10 G83*12 |
注: 厚度可按客戶需要定做規(guī)格
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Ⅰ.Dimension in common usage(mm)
Apply the board
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Apply the board
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Apply the board
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Different piece
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112*112
300*150 98*98 93*83 |
113*113
170*170 145*145 140*140 |
130*130
150*150 115*115 ¢117 83*83 |
V60*18
G72*10 G83*12 |
Note :The thickness can be produced by customers’ require
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二、理化指標(biāo)
化學(xué)成分
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標(biāo)準(zhǔn)指標(biāo)
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物理性能
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標(biāo)準(zhǔn)指標(biāo)
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ZrO2
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>93%
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體積密度(g/cm3)
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3.8~4.5
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CaO
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>3.6%
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顯氣孔率(%)
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18~28
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SiO2
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<0.4%
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荷重軟化溫度(℃)
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1650
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Al2O3
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<2.0%
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膨脹系數(shù){1000℃ (1/℃)}
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8.7*10-6
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Fe2O3
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<0.1%
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熱震穩(wěn)定性( 1100℃)
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>>20次
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Ⅱ. High Capability Zirconia Board Technique Index
Chemical Composition
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Index
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physical property
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Index
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ZrO2
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>93%
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volume concentration(g/cm3)
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3.8~4.5
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CaO
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>3.6%
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apparent porosity(%)
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18~28
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SiO2
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<0.4%
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refractoriness under load(℃)
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1650
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Al2O3
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<2.0%
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swell factor {1000℃ (1/℃)}
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8.7*10-6
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Fe2O3
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<0.1%
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hot shake stability( 1100℃)
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>>20
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